Modular cleanrooms are designed with a "building block" logic, allowing semiconductor factories to tailor the space layout according to specific process requirements.
For example, areas for photolithography, etching, and packaging can be configured with different cleanliness levels (from ISO 1 to ISO 9) independently.
This flexibility eliminates the need for large-scale reconstruction when upgrading production lines, significantly reducing downtime.
The modular panels, usually made of aluminum alloy or galvanized steel, can be assembled and disassembled quickly, supporting rapid expansion or adjustment of cleanroom areas as production scales change.
Each modular cleanroom unit is engineered with integrated sealing systems, including gasketed joints and pressure differential controls, to prevent cross-contamination between zones.
HVAC systems are modularized too, with dedicated air handling units (AHUs) for each section, ensuring precise control of temperature (±0.5°C), humidity (±2%), and particle counts.
High-efficiency particulate air (HEPA) or ultra-low penetration air (ULPA) filters are embedded in the ceiling and wall panels, providing unidirectional laminar airflow that minimizes particle accumulation on wafers.
Additionally, modular cleanrooms feature integrated floor drainage and waste management systems, containing hazardous materials within specific zones to avoid spreading contaminants.
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